Research field (2)：
Material fabrication and microstructure control
, Manufacturing and production engineering
Research keywords (4)：
超精密加工
, 表面
, 研磨
, 精密加工
Research theme for competitive and other funds (10)：
2023 - 2026 トライボプラズマを援用したダイヤモンド基板の高能率ドライエッチング法の開発
2018 - 2021 Development of high-efficiency wet polishing method for diamond substrate utilizing ultraviolet light / ozone gas
2014 - 2017 Development of process performance for diamond wafers and cutting / grinding tools by ultraviolet irradiation polishing
2013 - 2015 Development of high-efficiency polishing process of the diamond substrate for next-generation power devices
2011 - 2014 Development of UV-Assisted Polishing Technology to Realize Diamond Wafer for Power Electric Devices
2011 - 2014 Development of the high efficiency high precision wet processing method required for the SiC power device fabrication
2011 - 2012 Development of an ultra-smooth polishing technique required for thediamond power device fabrication
2008 - 2009 Development of an ultra-smooth surface formation technique required for highly efficient SiC power device fabrication.
2006 - 2007 触媒作用を援用した化学研磨プロセスによるSiC基板表面平坦化に関する研究
2004 - 2005 EEMによる次世代半導体・光学デバイス表面創製技術の開発
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Papers (80)：
Kouki Hasegawa, Shigeru Tanaka, Daisuke Inao, Masatoshi Nishi, Akihisa Kubota, Kazuyuki Hokamoto. Dynamic compression of a polymer stamper using high-impulse underwater shock waves to imprint a sub-micrometer structure on a metal plate surface. Journal of Materials Research and Technology. 2023. 24. 6730-6738
Kouki Hasegawa, Shigeru Tanaka, Ivan Bataev, Daisuke Inao, Matatoshi Nishi, Akihisa Kubota, Kazuyuki Hokamoto. Toward a Better Understanding of Shock Imprinting with Polymer Molds Using a Combination of Numerical Analysis and Experimental Research. Materials. 2022. 15. 5. 1727-1727
Shuichi Hiza, Ken Imamura, Yusuke Shirayanagi, Koji Yoshitsugu, Yuki Takiguchi, Kunihiko Nishimura, Hideki Takagi, Hideaki Yamada, Akihisa Kubota, Mikio Yamamuka. Development of GaN-on-Diamond HEMT Using Diamond Substrate with Large Area. IEEJ Transactions on Electronics, Information and Systems. 2022. 142. 3. 354-359
S. Hiza, Y. Shirayanagi, Y. Takiguchi, K. Nishimura, T. Matsumae, Y. Kurashima, E. Higurashi, H. Takagi, A. Chayahara, Y. Mokuno, et al. GaN-HEMTs on diamond prepared by room-temperature bonding technology. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. 2021. 16
Kouki Hasegawa, Shigeru Tanaka, Ivan Bataev, Daisuke Inao, Masatoshi Nishi, Akihisa Kubota, Kazuyuki Hokamoto. One-dimensional nanoimprinting using linear explosives. Materials & Design. 2021. 203. 109607-109607
2002 - 2005 Osaka University Graduate School of Engineering Department of Precision Science and Technology
2000 - 2002 Osaka University Graduate School of Engineering Department of Precision Science and Technology
1996 - 2000 Osaka University School of Engineering Department of Applied Science
Professional career (1)：
Doctor of Engineering (Osaka University)
Work history (6)：
2020/04 - 現在 Kumamoto University
2016/04 - 現在 Kumamoto University Unregistered
2012/06 - 2016/03 熊本大学大学院自然科学研究科(工学系)先端機械システム 准教授
2007/04 - 2012/05 熊本大学大学院自然科学研究科(工学系)先端機械システム 助教
2005 - 2006 Kumamoto University Faculty of Engineering
2004 - 2005 日本学術振興会 日本学術振興会特別研究員
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Awards (9)：
2016/06 - 平成27年度第37次工作機械技術論文賞
2015/06 - 平成26年度第36次工作機械技術論文賞
2015/03 - 平成26年度砥粒加工学会論文賞
2014/11 - 熊本大学研究活動表彰
2013 - 平成24年度第34次工作機械技術振興賞(奨励賞)
2012/05 - 熊本大学研究活動表彰
2010/05 - マザック財団高度生産システム研究論文賞
2008 - 2008年度船井情報科学奨励賞受賞
2006 - マザック財団高度生産システム研究論文賞
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Association Membership(s) (4)：
THE JAPAN SOCIETY OF APPLIED PHYSICS
, THE JAPAN SOCIETY FOR ABRASIVE TECHNOLOGY
, THE JAPAN SOCIETY OF MECHANICAL ENGINEERS
, THE JAPAN SOCIETY FOR PRECISION ENGINEERING
