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J-GLOBAL ID：200902293784023680   Reference number：04A0806253

Effect of Additives on Hole Filling Characteristics of Electroless Copper Plating

Cuの無電解メッキにおける孔の充填特性に対する添加物の効果

Author (5)： WANG Z (Hiroshima Univ., Higashi-Hiroshima, JPN) ,  YAEGASHI O (Hiroshima Univ., Higashi-Hiroshima, JPN) ,  SAKAUE H (Hiroshima Univ., Higashi-Hiroshima, JPN) ,  TAKAHAGI T (Hiroshima Univ., Higashi-Hiroshima, JPN) ,  SHINGUBARA S (Hiroshima Univ., Higashi-Hiroshima, JPN)
Material： Japanese Journal of Applied Physics. Part 1. Regular Papers, Short Notes & Review Papers  (Japanese Journal of Applied Physics. Part 1. Regular Papers, Brief Communications & Review Papers)
Volume： 43  Issue： 10  Page： 7000-7001  Publication year： Oct. 15, 2004 
JST Material Number： G0520B  ISSN： 0021-4922  Document type： Article
Article type： 短報  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *Copper ,...

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JST classification (1)： Electroless plating  (WC08024S)

Substance index (4)： 2-Mercaptonicotinic acid ,  Thiourea ,  Benzotriazole ,  Bis(3-sulfopropyl) persulfide

Reference (12)：

• 1) M. Kang and A. A. Gewirth: J. Electrochem. Soc. 150 (2003) C426.
• 2) W. P. Dow, H. S. Huang and Z. Lin: Electrochem. Solid-State Lett. 6 (2003) C134.
• 3) S. Y. Chiu, J. M. Shih, S. C. Chang, K. C. Lin, B. T. Dai, C. F. Chen and M. S. Fang: J. Vac. Sci. & Technol. B <B>18</B> (2000) 2835.
• 4) T. P. Moffat, B. Baker, D. Wheeler and D. Joel: Electrochem. Solid-State Lett. 6 (2003) C59.
• 5) S. G. Pym, S. Kim, D. Wheeler, T. P. Moffat and D. Joel: J. Appl. Phys. 93 (2003) 1257.

Terms in the title (3)： Cu ,  無電解メッキ ,  添加物