Special Issue Molding and effect of grinding wheel and polishing pad; Relationship between microscale circulation flow of slurry and material removal rate in CMP. Journal of the Japan Society for Abrasive Technology. 2023. 67. 2. 79-82
DOI Toshiro, HIYAMA Hirokuni, FUKUDA Akira, KUROKAWA Shuhei. Trend of Semiconductor Devices and Planarization Technology with Future Development. Journal of the Japan Society for Precision Engineering. 2007. 73. 7. 745-750
Development of Simulation Method for Material Removal Rate Distribution Considering Slurry Polishing Ability
(The 18th International Conference on Planarization/CMP Technology 2023 2023)
Relationship between removal rate and slurry flow in glass polishing
(2021)
Development of simulation of removal rate distribution by paying attention to slurry polishing ability (4th report) Use of analysis results of temperature distribution
(2021)